Technical Program Committee

Michael D. Abramoff, University of Iowa, USA
Mustaque Ahamad, Georgia Tech, USA
Giuseppe Anastasi, University of Pisa, Italy
Yan Bai, University of Washington Tacoma, USA
David Bakken, Washington State University, USA
Christian Becker, Universität Mannheim, Germany
Prabir Bhattacharya, University of Cincinnati, USA
Yixin Cao, The Hong Kong Polytechnic University, Hong Kong
Rosanna Yuen-Yan Chan, The Chinese University of Hong Kong, Hong Kong
Sriram Chellappan, Missouri University of Science and Technology, USA
Dehua Chen, Donghua University, China
Kwang-Cheng Chen, National Taiwan University, Taiwan
Min Chen, Huazhong University of Science and Technology, China
Renhai Chen, The Hong Kong Polytechnic University, Hong Kong
Peter Han Joo Chong, Nanyang Technological University, Singapore
Korris Chung, The Hong Kong Polytechnic University, Hong Kong
Diane J. Cook, Washington State University, USA
Domenico Cotroneo, University of Naples, Italy
Debraj De, Missouri University of Science and Technology, USA
Yuri Demchenko, University of Amsterdam, The Netherlands
Christof Fetzer, Technische Universität Dresden, Germany
Frank H.P. Fitzek, Aalborg University, Denmark
Mario Di Francesco, Aalto University, Finland
Hiroshi Fujita, Gifu University, Japan
Giacomo Ghidini, The University of Texas at Arlington, USA
Wei Gong, University of Ottawa, Canada
Song Guo, The University of Aizu, Japan
Zongjian He, The Hong Kong Polytechnic University, Hong Kong
Matti Hiltunen, AT&T Labs – Research, USA
Yennun Huang, Academia Sinica, Taiwan
Xiaoyi Jiang, University of Muenster, Germany
Xin Jin, The University of Hong Kong, Hong Kong
Zbigniew Kalbarczyk, University of Illinois at Urbana Champaign, USA
Nobuyasu Kanekawa, Hitachi, Ltd. ,Japan
Salil S Kanhere, The University of New South Wales, Australia
Sokratis Katsikas, University of Piraeus, Greece
Abdelmajid Khelil, Huawei European Research Center, Germany
Rajiv Khosla, La Trobe University, Australia
Philip Koopman, Carnegie Mellon University, USA
Ajay Kumar, The Hong Kong Polytechnic University, Hong Kong
Mohan J Kumar, Rochester Institute of Technology, USA
Sy-Yen Kuo, National Taiwan University, Taiwan
Chin-Feng Lai, National Ilan University,
Victor Lee, City University of Hong Kong, Hong Kong
Carson K. Leung, University of Manitoba, Canada
Karl Leung, Hong Kong Institute of Vocational Education, Hong Kong
Chendong Li, University of Connecticut, USA
Kin Fun Li, University of Victoria, Canada
Shuai Li, The Hong Kong Polytechnic University, Hong Kong
Tao Li, The Hong Kong Polytechnic University, Hong Kong
Xitong Li, HEC Paris, France
Guanqing Liang, The Hong Kong Polytechnic University, Hong Kong
Ning Liu, Sun Yat-Sen University, China
Xuefeng Liu, The Hong Kong Polytechnic University, Hong Kong
Yonghe Liu, The University of Texas at Arlington, USA
Wei Lou, The Hong Kong Polytechnic University, Hong Kong
Chenyang Lu, Washington University in St. Louis, USA
Hongliang Lu, National University of Defense Technology, China
Jesus Luna, Technical University Darmstadt, Germany
Sanjay Madria, Missouri University of Science and Technology, USA
Ashraf Matrawy, Carleton University, Canada
Avi Mendelson, Technion – Israel Institute of Technology, Israel
Aad van Moorsel, University of Newcastle upon Tyne, United Kingdom
Max Muehlhaeuser, Technical University Darmstadt, Germany
Takashi Nanya, Canon Inc., Japan
Joseph Kee-Yin Ng, Hong Kong Baptist University, Hong Kong
Vincent Ng, Hong Kong Polytechnic University, Hong Kong
Edith C.-H. Ngai, Uppsala University, Sweden
Jukka K. Nurminen, , Aalto University, Finland
Andrea Passarella, L'Istituto di Informatica e Telematica del CNR, Italy
Karthik Pattabiraman, The University of British Columbia, India
Dirk Pesch, Nimbus Centre for Embedded Systems Research Cork Institute of Technology, Ireland
Tuan Pham, The University of Aizu, Japan
Cristina M. Pinotti, University of Perugia, Italy
Edwige E. Pissaloux, University Pierre and Marie CURIE, France
Andreas Reinhardt, The University of New South Wales, Australia
Matei Ripeanu, The University of British Columbia, Canada
Nirmalya Roy, University of Maryland Baltimore County, USA
Stefano Russo, Prof. Università di Napoli Federico II, Italy
Abusayeed Saifullah, Washington University in St. Louis, USA
Srikanth Sastry, Google Inc. ,USA
Boon-Chong Seet, Auckland University of Technology, New Zealand
Zili Shao, The Hongkong Polytechnic University, Hong Kong
Dinggang Shen, The University of North Carolina at Chapel Hill, USA
Zhengguo Sheng, The University of British Columbia, Canada
Simone Silvestri, Missouri University of Science and Technology, USA
Purnendu Sinha, Samsung R&D Institute India, India
Joseph So, Hong Kong Community College, Hong Kong
JaeSeung Song, Sejong University, Korea
Ivan Stojmenovic, University of Ottawa, Canada
Peyman TalebiFard, The University of British Columbia, Canada
Vincent Tam, University of Hong Kong, Hong Kong
Feilong Tang, Shanghai Jiao Tong University, China
Dacheng Tao, University of Technology, Sydney, Singapore
Mladen Vouk, North Carolina State University, USA
Jiafu Wan, South China University of Technology, China
Chunyan Wang, Concordia University, Canada
Dan Wang, The Hong Kong Polytechnic University, Hong Kong
Xiaofei Wang, The University of British Columbia, Canada
Charles Weinstock, Software Engineering Institute, USA
Sheng Wen, Deakin University, Australia
Tomasz Wiktor Wlodarczyk, University of Stavanger, Norway
Weigang Wu, Sun Yat-sen University, China
Bin Xiao, The Hong Kong Polytechnic University, Hong Kong
Geng Yang, Nanjing University of Posts and Telecommunications, China
Laurence T. Yang, St. Francis Xavier University, Canada
Man Lung Yiu, Hong Kong Polytechnic University, Hong Kong
Eiko Yoneki, University of Cambridge, United Kingdom
Jane You, The Hong Kong Polytechnic University, Hong Kong
Chia-Mu Yu, Yuan Ze University, Taiwan
F. Richard Yu, Carleton University, Canada
Y. T. Yu, City University of Hong Kong, Hong Kong
Pong C Yuen, Hong Kong Baptist University, Hong Kong
Lei Zhang, The Hong Kong Polytechnic University, Hong Kong
Huiyu Zhou, Queens' University Belfast, United Kingdom
Quan Zhou, Guangzhou University, China


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